![]() Topics discussed include direct-current, small-signal, and transient analyses of diodes and transistors optoelectronic devices ion. Also shown are the electric potential profile and the norm of the current density. Take a look at this video to learn about the Semiconductor Module, an add-on product to the COMSOL Multiphysics software that has dedicated functionality for semiconductor device physics simulations. The solved model depicts the temperature profile of the fuse ranging from room temperature to the maximum temperature in the fuse. After watching this video, you will know how to do the following: Create a new form with the New Form wizard. The second chapter of the video series completes the simulation by demonstrating how to add the physics and solve the model. As you will see, the material properties are selected from the built-in Material Library, but you could also use your own material or even experimental data from an external source, such as Excel®. Chapter 1 walks you through building the model and adding the appropriate materials and their properties. Copper lines or traces feed the fuse, which is made of aluminum, and we’re interested in if we will exceed the melting-point of aluminum (933 Kelvin), or if the convection cooling will be adequate. In these tutorials, Linus Andersson from the Global Technical Support Team here at COMSOL will show you how to couple the direct current electrical current in a fuse on a circuit board to the heat transfer in it and the surrounding system. The 2-chapter video tutorial demonstrates how to model the Joule heating of a fuse, seeking to answer the question: “Will it blow?”. Here, we’ve produced a video resource for you to see how you can effectively simulate Joule heating using COMSOL Multiphysics. The MEMS Module is used for simulating quartz oscillators as well as many other types of piezoelectric devices. These are particularly helpful if you are new to the COMSOL Multiphysics software, though even experienced users can learn from them. The second type of tutorial videos are Core Functionality videos. COMSOL eases these challenges by providing a specialized multiphysics interface for Joule heating, allowing for quick and easy definition of the phenomenon and even includes the ability to model convection for removing the heat. Simulate MEMS Devices and a Variety of Multiphysics Interactions. The model workflow in COMSOL Multiphysics is the same for all disciplines and applications but with slight variations. ![]() The design challenge is to remove this heat as effectively as possible. When a structure is heated by electric currents, the device can reach high temperatures and either structurally degenerate or even melt. The potential drawn in this model was compared with the paper by Jaegle (Example 3) and a good match was observed. Seebeck effect is a phenomena where the difference in temperature of a material leads to a potential difference. ![]() Some Joule heating examples include heating of conductors in electronics, fuses, electric heaters, and power lines. In this model, we show how to model Seebeck effect which works as a thermoelectric generator. To illustrate the accuracy of the reduced model, a comparison with the output from the FEM model is also included.One of the classic multiphysics couplings in engineering and science is Joule heating, also called resistive heating or ohmic heating. In this tutorial model, it is illustrated how to create a reduced-order model using the Model Reduction study and how the resulting reduced model can be used to investigate different control strategies for thermal control. The system works in a very simple manner: The thermostat turns the heater on and off when its temperature is too low or too high. Inside, there is a heater and a thermostat switch. The figures below show another version of the MEMS capacitor model, where the dielectric material is replaced by an anisotropic piezoelectric material (PZT-5H). The dynamical system consists of a metal block that exchanges heat with the exterior. COMSOL Multiphysics version 5.3 comes with a predefined multiphysics coupling that combines finite-element-based and boundary-element-based electrostatics. From here, the driving force factor and the blocked voice coil impedance can be extracted and exported. The first analysis solves only the electromagnetic part of the problem when the driver is at rest. The objective for model reduction is to provide a sufficiently accurate representation of the input-output dynamics of the unreduced model in a given parameter range with a minimal total computational cost, including the cost of creating the reduced model. The tutorial model is set up using a combination of the Magnetic Fields interface and the Acoustic-Structure Interaction multiphysics interface. ROMs are typically valid only in the vicinity of their design conditions and have lower accuracy, but the simulation time is significantly shorter. Large FEM simulations can be costly and, if repeated simulations are needed, it can be beneficial to use reduced-order models (ROMs).
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